The 2nd International Conference on High Performance Big Data and Intelligent Systems (HPBD&IS 2020) was originally planned to be held in Shenzhen, China on May 22-25, 2020. However, with due regard to the safe and healthy environment in China and the global, HPBD&IS 2020 has been successfully held online on May 23, 2020.
The conference papers of HPBD&IS 2020 have been published by IEEE Xplore® and indexed by EI Compendex.
More than 10 papers have been published in the Special Issue of SCI indexed journal- Concurrency and Computation Practice and Experience (CCPE).
IEEE Computer Society
Chinese Association for Artificial Intelligence
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences
Institute of Semiconductors, Chinese Academy of Sciences
Shenzhen Longgang District Robotics Association
Shenzhen International Robot City Industrial Park
Professional Committee on Neural Networks and Computational Intelligence
CCF Technical Committee on Blockchain
AEEEIT Committee on Blockchain
Illinois Institute of Technology, USA
Indiana University, USA
University of Macau, China
Institute of Semiconductors, CAS
Shenzhen DAPU Microelectronics Co., Ltd
Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
Keke Gai, Beijing Institute of Technology, China
Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China
Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China
Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China
Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China
Haibo He, University of Rhode Island, USA
Hong Jiang, University of Texas, Arlington, USA
Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China
Ahmed Louri, George Washington University, USA
Xian-He Sun, Illinois Institute of Technology, USA
Yuan Xie, University of California, Santa Barbara, USA
Cheng-Zhong Xu, University of Macau, China
Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA
Imane El Alaoui, University of Ibn Tofail, Morocco
Dong An, China Agricultural University, China
Ado Adamou Abba Ari, University of Versailles St Quentin En Yvelines, France
Xiao Bai, Beihang University, China
Weiqun Cao, Beijing Forestry University, China
Aniello Castiglione, University of Naples Parthenope, Italy
Kasidit Chanchio, Thammasat University, Thailand
Bhaskar Chaudhury, Dhirubhai Ambani Inst. of Information and Communication Technology, India
Jianhai Chen, Zhejiang University, China
Quan Chen, Shanghai Jiao Tong University, China
Renhai Chen, Tianjin University, China
Xu Chen, Institute of Semiconductors, Chinese Academy of Sciences, China
Yiqiang Chen, Institute of Computing Technology, Chinese Academy of Sciences, China
Jian Cheng, Institute of Automation, Chinese Academy of Sciences, China
Xiaoxin Cui, Peking University, China
Haojiang Deng, The Institute of Acoustics of the Chinese Academy of Sciences, China
Kamil Dimililer, Near East University, Turkey.
Shifei Ding, China University of Mining and Technology, China
Xinghao Ding, Xiamen University, China
Xiaoli Dong, Institute of Semiconductors, Chinese Academy of Sciences, China
Aleksey G. Finogeev, Penza State University, Russia
Shaojing Fu, NUDT, China
Keke Gai, Beijing Institute of Technology, China
Chengxi Gao, Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences, China
Xitong Gao, Shenzhen Institutes of Advanced Technology, China
Mohammad Samadi Gharajeh, Islamic Azad University, Iran
Zhiguo Gong, University of Macau, China
Daniel Grosu, Wayne State University, USA
Donghui Guo, Xiamen University, China
Qi Guo, ICT/CAS, China
Song Guo, The Hong Kong Polytechnic University, China
Badr Ait Hammou, Mohammed V University in Rabat, Morocco
Haibo He, University of Rhode Island, USA
Haiwu He, Shandong Computer Science Center, National Supercomputer Center in Jinan, China
Shuibing He, University of Wuhan, China
Xubin He, Temple University, USA
Dan Huang, Sun Yat-sen University, China
Hong Jiang, University of Texas, Arlington, USA
Song Jiang, University of Texas at Arlington, USA
Hamid Khayyam, Royal Melbourne Institute of Technology University, Australia
Young Choon Lee, Macquarie University, Australia
Dajiang Lei, Chongqing University of Posts and Telecommunications, China
Jingwen Leng, Shanghai Jiao Tong University, China
Chao Li, Shanghai Jiao Tong University, China
Dong Li, University of California, USA
Li Li, Shenzhen Institutes Of Advanced TechnologyChinese Academy Of Sciences, China
Ruifan Li, Beijing University of Posts and Telecommunications, China
Sheng Li, Zhongnan University of Economics and Law, China
Weijun Li, Institute of Semiconductors, CAS, Shenzhen DAPU Microelectronics Co., Ltd., China
Xingsen Li, Guangdong University of Technology, China
Zhuo Li, State Street Technology (Zhejiang) Ltd., China
Fang Liu, Sun Yat-sen University, China
Yan Liu, Huaqiao University, China
Yuhong Liu, Santa Clara University, USA
Ahmed Louri, George Washington University, USA
Xueqiang Lv, Beijing Information Science and Technology University, China
Tianhui Meng, SIAT/CAS, China
Wei Meng, Beijing Forestry University, China
Neha K. Nawandar, Visvesvaraya National Institute of Technology, India
Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China
Rui Oliveira, University of Minho and INESC TEC, Portugal
Shaoliang Peng, National Supercomputing Center in Changsha,China
Calton Pu, Georgia Institute of Technology, USA
Hong Qin, Institute of Semiconductors, Chinese Academy of Sciences, China
Huang Qiong, South China Agricultural University, China
Jianlong Qiu, Linyi University, China
M. Mustafa Rafique, Rochester Institute of Technology, USA
Hari Mohan Rai, Krishna College of Engineering, India
Jose Luis Calvo Rolle, University of A Coruña, Spain
Carlos Silvestre, University of Macau, China
Manik Sharma, DAV University Jalandhar, India
Rongxuan Shen, Institute of Semiconductors, Chinese Academy of Sciences, China
Jiwu Shu, Tsinghua University, China
Xian-He Sun, Illinois Institute of Technology, USA
Bo Tang, Mississippi State University,USA
Yufei Tang, Florida Atlantic University, USA
Christos Troussas, University of West Attica, Greece
António Amaro Costa Vieira, University of Minho, Portugal
Donghui Wang, The Institute of Acoustics of the Chinese Academy of Sciences, China
Huidong Wang, Shandong University of Finance and Economics, China
Jianping Wang, City University of Hong Kong, China
Lin Wang, Xiamen University, China
Pengjun Wang, College of Electrical and Electronic Engineering, Wenzhou University, China
Yang Wang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
Yi Wang, Shenzhen University, China
Pulasthi S. Wickramasinghe, Indiana University, USA
Christopher Woods, University of Bristol, UK
Fei Wu, Huazhong University of Science and Technology, China
Qingyao Wu, South China University of Technology, China
Wen Xia, Harbin Institute of Technology, China
Chunhua Xiao, Chongqing University, China
Nong Xiao, NUDT, China
Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences, China
Xiaodong Xie, Huaqiao University, China
Yuan Xie, University of California, Santa Barbara, USA
Cheng-Zhong Xu, University of Macau, China
Guoyao Xu, Alibaba Group, China
Jian Xu, Institute of Semiconductors, Chinese Academy of Sciences, China
Minxian Xu, Shenzhen Institutes of Advanced Technology,Chinese Academy of Sciences, China
Zichen Xu, Nanchang University, China
Feng Yan, University of Nevada, Reno, USA
Jun Yan, Concordia University, Canada
Guowei Yang, Nanjing Audit University, Qingdao University, China
Huihua Yang, BeijingUniversity of Posts and Telecommunications, China
Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA
Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
Jun Yi, Chongqing University of Science and Technology, China
Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China
Yunhua Yu, China University Of Petroleum, China
Jiazheng Yuan, Beijing Open University, China
Jidong Zhai, Tsinghua University, China
Fengwei Zhang, Southern University of Science and Technology, China
Jianlin Zhang, Nanchang University, China
Liping Zhang, Institute of Semiconductors, Chinese Academy of Sciences, China
Xiaorong Zhang, California State University. SF., USA
Juanjuan Zhao, Chinese Academy of Sciences, China
Wenli Zheng, Shanghai Jiao Tong University, China
Ke Zhou, Huazhong University of Science and Technology, China
Dazhou Zhu, Institute of Food and Nutrition Development, Ministry of Agriculture and Rural Affairs, China
ETH Zürich, Switzerland, key member of the Message Passing Interface (MPI) Forum, Chair of the "Collective Operations and Topologies" working group.
University Distinguished Professor of Computer Science at the Department of Computer Science in the Illinois Institute of Technology (IIT), the director of the Scalable Computing Software laboratory at IIT and guest faculty in the Mathematics and Computer Science Division at the Argonne National Laboratory.
