The 3rd International Conference on High Performance Big Data and Intelligent Systems (HPBD&IS 2021) was successfully held in Macau, China on December 5-7, 2021, bringing together the world's top experts, scholars and outstanding talents in the industry, and conducting open discussions around international hot topics, core key technologies, industrial development and challenges.
The conference papers of HPBD&IS 2021 have been published by IEEE Xplore® and indexed by EI Compendex.
More than 10 papers have been published in the Special Issue of SCI indexed journal- Concurrency and Computation Practice and Experience (CCPE).
China Computer Federation
Chinese Association for Artificial Intelligence
IEEE Computer Society
University of Macau
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences
Institute of Semiconductors, Chinese Academy of Sciences
CCF TC on High Performance Computing
Professional Committee on Neural Networks and Computational Intelligence
CAA TC on Pattern Recognition and Machine Intelligence
Beijing Union University
Tianjin University of Technology
Shenzhen Longgang District Robotics Association
Shenzhen International Robot City Industrial Park
Illinois Institute of Technology, USA
Indiana University, USA
University of Macau, China
Institute of Semiconductors, CAS
Shenzhen DAPU Microelectronics Co., Ltd
University of Macau, China
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
University of Rhode Island,
Shenzhen DAPU Microelectronics Co., Ltd., USA
Dr. Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China
Dr. Chen Wang, Beihang University, China
Dr. Liang Yuan, Institute of Computing Technology, Chinese Academy of Sciences, China
Prof. Wenfa Li, Beijing Union University, China
Prof. Yufei Tang, Florida Atlantic University, USA
Prof. Xuanhua Shi, Huazhong University of Science and Technology, China
Dr. Iftikhar Ahmed Saeed, University of Lahore, Pakistan
Dr. Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China
Prof. Xiao Bai, Beihang University, China
Prof. Leong Hou U, Ryan, University of Macau, China
Dr. Baoli Lu, Institute of Semiconductors, Chinese Academy of Sciences, China
Ms. Xidai Li, Technical Committee of HPC, China Computer Federation, China
Mr.Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China
Dr. Minxian Xu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China
Dr. Zhenning Li, University of Macau, China
Prof. Sheng Li, Zhongnan University of Economics and Law, China
Prof.Fei Wu, Huazhong University of Science and Technology, China
Prof.Jidong Zhai, Tsinghua University, China
Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA
Xian-He Sun, Illinois Institute of Technology, USA.
Cheng-Zhong Xu, University of Macau, China.
Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China.
Haibo He, University of Rhode Island, USA.
Yuan Xie, University of California, Santa Barbara, USA.
Hong Jiang, University of Texas, Arlington, USA.
Ahmed Louri, George Washington University, USA.
Yunquan Zhang, Institute of Computing Technology, Chinese Academy of Sciences, China.
Imane El Alaoui, University of Ibn Tofail, Morocco.
Dong An, China Agricultural University, China.
Ado Adamou Abba Ari, University of Versailles St Quentin En Yvelines, France.
Xiao Bai, Beihang University, China.
Weiqun Cao, Beijing Forestry University, China.
Aniello Castiglione, University of Naples Parthenope, Italy.
Kasidit Chanchio, Thammasat University, Thailand.
Bhaskar Chaudhury, Dhirubhai Ambani Inst. of Information and Communication Technology, India.
Jianhai Chen, Zhejiang University, China.
Quan Chen, Shanghai Jiao Tong University, China.
Renhai Chen, Tianjin University, China.
Xu Chen, Institute of Semiconductors, Chinese Academy of Sciences, China.
Yiqiang Chen, Institute of Computing Technology, Chinese Academy of Sciences, China.
Jian Cheng, Institute of Automation, Chinese Academy of Sciences, China.
Xiaoxin Cui, Peking University, China.
Haojiang Deng, The Institute of Acoustics of the Chinese Academy of Sciences, China.
Kamil Dimililer, Near East University, Turkey.
Shifei Ding, China University of Mining and Technology, China.
Xinghao Ding, Xiamen University, China.
Xiaoli Dong, Institute of Semiconductors, Chinese Academy of Sciences, China.
Aleksey G. Finogeev, Penza State University, Russia.
Shaojing Fu, NUDT, China.
Keke Gai, Beijing Institute of Technology, China.
Chengxi Gao, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
Xitong Gao, Shenzhen Institutes of Advanced Technology, China.
Mohammad Samadi Gharajeh, Islamic Azad University, Iran.
Zhiguo Gong, University of Macau, China.
Daniel Grosu, Wayne State University, USA.
Donghui Guo, Xiamen University, China.
Qi Guo, ICT/CAS, China.
Song Guo, The Hong Kong Polytechnic University, China.
Badr Ait Hammou, Mohammed V University in Rabat, Morocco.
Haibo He, University of Rhode Island, USA.
Haiwu He, Shandong Computer Science Center, National Supercomputer Center in Jinan, China.
Shuibing He, University of Wuhan, China.
Xubin He, Temple University, USA.
Dan Huang, Sun Yat-sen University, China.
Hong Jiang, University of Texas, Arlington, USA.
Song Jiang, University of Texas at Arlington, USA.
Hamid Khayyam, Royal Melbourne Institute of Technology University, Australia.
Young Choon Lee, Macquarie University, Australia.
Dajiang Lei, Chongqing University of Posts and Telecommunications, China.
Jingwen Leng, Shanghai Jiao Tong University, China.
Chao Li, Shanghai Jiao Tong University, China.
Dong Li, University of California, USA.
Li Li, Shenzhen Institutes Of Advanced TechnologyChinese Academy Of Sciences, China.
Ruifan Li, Beijing University of Posts and Telecommunications, China.
Sheng Li, Zhongnan University of Economics and Law, China.
Weijun Li, Institute of Semiconductors, CAS, Shenzhen DAPU Microelectronics Co., Ltd., China.
Xingsen Li, Guangdong University of Technology, China.
Zhuo Li, State Street Technology (Zhejiang) Ltd., China.
Fang Liu, Sun Yat-sen University, China.
Yan Liu, Huaqiao University, China.
Yuhong Liu, Santa Clara University, USA.
Ahmed Louri, George Washington University, USA.
Xueqiang Lv, Beijing Information Science and Technology University, China.
Tianhui Meng, SIAT/CAS, China.
Wei Meng, Beijing Forestry University, China.
Neha K. Nawandar, Visvesvaraya National Institute of Technology, India.
Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China.
Rui Oliveira, University of Minho and INESC TEC, Portugal.
Shaoliang Peng, National Supercomputing Center in Changsha, China.
Calton Pu, Georgia Institute of Technology, USA.
Hong Qin, Institute of Semiconductors, Chinese Academy of Sciences, China.
Huang Qiong, South China Agricultural University, China.
Jianlong Qiu, Linyi University, China.
M. Mustafa Rafique, Rochester Institute of Technology, USA.
Hari Mohan Rai, Krishna College of Engineering, India.
Jose Luis Calvo Rolle, University of A Coruña, Spain.
Iftikhar Ahmed Saeed, University of Lahore, Pakistan.
Carlos Silvestre, University of Macau, China.
Manik Sharma, DAV University Jalandhar, India.
Rongxuan Shen, Institute of Semiconductors, Chinese Academy of Sciences, China.
Jiwu Shu, Tsinghua University, China.
Xian-He Sun, Illinois Institute of Technology, USA.
Bo Tang, Mississippi State University, USA.
Yufei Tang, Florida Atlantic University, USA.
Christos Troussas, University of West Attica, Greece.
António Amaro Costa Vieira, University of Minho, Portugal.
Donghui Wang, The Institute of Acoustics of the Chinese Academy of Sciences, China.
Huidong Wang, Shandong University of Finance and Economics, China.
Jianping Wang, City University of Hong Kong, China.
Lin Wang, Xiamen University, China.
Pengjun Wang, College of Electrical and Electronic Engineering, Wenzhou University, China.
Yang Wang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
Yi Wang, Shenzhen University, China.
Pulasthi S. Wickramasinghe, Indiana University, USA.
Christopher Woods, University of Bristol, UK.
Fei Wu, Huazhong University of Science and Technology, China.
Qingyao Wu, South China University of Technology, China.
Wen Xia, Harbin Institute of Technology, China.
Chunhua Xiao, Chongqing University, China.
Nong Xiao, NUDT, China.
Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences, China.
Xiaodong Xie, Huaqiao University, China.
Yuan Xie, University of California, Santa Barbara, USA.
Cheng-Zhong Xu, University of Macau, China.
Guoyao Xu, Alibaba Group, China.
Jian Xu, Institute of Semiconductors, Chinese Academy of Sciences, China.
Minxian Xu, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
Zichen Xu, Nanchang University, China.
Feng Yan, University of Nevada, Reno, USA.
Jun Yan, Concordia University, Canada.
Guowei Yang, Nanjing Audit University, Qingdao University, China.
Huihua Yang, BeijingUniversity of Posts and Telecommunications, China.
Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA.
Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
Jun Yi, Chongqing University of Science and Technology, China.
Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China.
Yunhua Yu, China University of Petroleum, China.
Jiazheng Yuan, Beijing Open University, China.
Jidong Zhai, Tsinghua University, China.
Fengwei Zhang, Southern University of Science and Technology, China.
Jianlin Zhang, Nanchang University, China.
Liping Zhang, Institute of Semiconductors, Chinese Academy of Sciences, China.
Xiaorong Zhang, California State University. SF., USA.
Juanjuan Zhao, Chinese Academy of Sciences, China.
Wenli Zheng, Shanghai Jiao Tong University, China.
Ke Zhou, Huazhong University of Science and Technology, China.
Dazhou Zhu, Institute of Food and Nutrition Development, Ministry of Agriculture and Rural Affairs, China.
Distinguished Professor, Director of the Institute for Data Science at New Jersey Institute of Technology
Sohaib and Sara Abbasi Professor and Willett Faculty Scholar at the Department of Computer Science, the University of Illinois at Urbana Champaign, IEEE Fellow, ACM Fellow
Fellow of Royal Academy of Engineering, Emeritus Professor at the University of York, Adjunct Professor at Beihang University, Distinguished Chair Professor at Xiamen University, IAPR Fellow, IEEE Fellow, BMVA Distinguished Fellow
Distinguished Professor, IET Fellow, Vice President, Tianjin University of Technology
Organizer:
Prof. Song Jiang, University of Texas at Arlington, USA
Panelists:
Dr.Raju Rangaswami, Florida International University
Dr. XUE Chun Jason, City University of Hong Kong
Dr. Yuan-Hao Chang, Institute of Information Science (IIS), Academia Sinica
Dr. Rubao Lee, Rateup Inc
Dr. Xiao-Feng Li, Co-Founder and CEO CoCoPIE
